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Area Array Packaging Handbook: Manufacturing and Assembly | 1 Edition

Author: Gilleo,Ken

ISBN:0071374930
ISBN-13: 9780071374934

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Details about Area Array Packaging Handbook: Manufacturing and Assembly:

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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